Apple and Broadcom's Multi-billion-dollar Chip Deal in the U.S.

Apple announced a multibillion-dollar agreement with U.S. chipmaker Broadcom in May 2023 to develop and manufacture 5G radio frequency and wireless connectivity components on American soil. The deal was part of Apple's broader 2021 commitment to invest $430 billion in the U.S. economy over five years and represented a continued push to reduce reliance on overseas semiconductor manufacturing.

Under the multi-year arrangement, Broadcom — already one of Apple's largest chip suppliers — would expand its work designing and producing wireless components at facilities across the United States, including a major site in Fort Collins, Colorado. The partnership aligned with the broader national push to rebuild domestic semiconductor capacity, accelerated by the CHIPS and Science Act passed in 2022.

The 2023 deal was a down payment. In July 2026 Apple pushed its Broadcom commitment past $30 billion, its largest under the American Manufacturing Program, promising more than 15 billion US-made chips and a $1.5 billion Fort Collins expansion, and CNBC notes Broadcom told the SEC the contracts run through 2031. Yet Apple spent the interval needing Broadcom less. Its C1 modem shipped in the iPhone 16e in February 2025, and MacRumors reported that September that the N1 chip replaced Broadcom's Wi-Fi and Bluetooth parts in the iPhone 17. Broadcom keeps the FBAR filters Apple has not replaced. Apple gave no date for the new capacity, so watch whether Fort Collins output appears before that 2031 term runs out.